Simultaneous and selective wide gap partitioning of via structures using plating resist

ABSTRACT

A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

CLAIM OF PRIORITY UNDER 35 U.S.C. §119

The present application for patent claims priority to, U.S. ProvisionalU.S. Patent Application No. 61/801,134, filed Mar. 15, 2013, which isassigned to the assignee hereof and hereby expressly incorporated byreference in their entirety.

FIELD OF THE INVENTION

The present invention relates to printed circuit boards (PCBs), and moreparticularly, to systems and methods for simultaneously partitioning avia structure into electrically isolated portions by using platingresist within a PCB stackup for allowing a plurality of electricalsignals to traverse each electrically isolated portion withoutinterference from each other.

BACKGROUND

Consumers are increasingly demanding both faster and smaller electronicproducts. The use of PCBs has grown enormously as new electronicapplications are marketed. A PCB is formed by laminating a plurality ofconducting layers with one or more non-conducting layers. As the size ofa PCB shrinks, the relative complexity of its electricalinterconnections grows.

A plated via structure is traditionally used to allow signals to travelbetween layers of a PCB. The plated via structure is a plated holewithin the PCB that acts as a medium for the transmission of anelectrical signal. For example, an electrical signal may travel througha trace on one layer of the PCB, through the plated via structure'sconductive material, and then into a second trace on a different layerof the PCB.

Unfortunately, due to limitations within the prior art, the plated viastructure may be longer than necessary to perform the function ofelectrical connectivity. For example, the plated via structure mayextend completely through the PCB but only connect two traces on twoproximate adjacent layers. As a result, one or more stubs may be formed.A stub is excessive conductive material within the plated via structurewhich is not necessary to transport the electrical signal.

When a high speed signal is transmitted through the plated viastructure, a “stub effect” may distort the signal. The stub effect is aresult of the useless excess conductive material present within theplated via structure. The stub effect occurs when a portion of thesignal is diverted away from the trace connections and into one or morestubs of the plated via structure. The portion of the signal may bereflected from the end of the stub back toward the trace connectionsafter some delay. This delayed reflection may interfere with signalintegrity and increase, for example, the bit error rate of the signal.The degenerating effect of the stub effect may increase with the lengthof the stub. As much as 50% of signal attenuation at signals running at10 Gigabits per second may be due to the stub in the plated viastructure. Via structures with short stubs can be manufactured butrequire sequential processing, which increases costs substantially.

FIG. 1 is an illustration of a PCB 100 with a plated via structure 110and a stub 170 in the prior art. The PCB 100 consists of conductinglayers 130 separated by nonconductive dielectric layers 120. Typically,the plated via structure 110 includes a barrel (i.e., shaft of the viastructure) that is cylindrical in shape and is plated with a conductivematerial 180. The plated via structure 110 allows an electrical signal160 to transmit from a trace 140 on a first conducting layer 130 of thePCB 100 to a trace 150 on a second conducting layer 130. The stub 170 ofthe plated via structure 110 is the unnecessary portion of the platedvia structure 110, which may create the stub effect.

FIG. 2 is an illustration of the PCB 100 with the plated via structure110 after the stub 170 (shown in FIG. 1) has been removed bybackdrilling in the prior art. Backdrilling the unnecessary portion ofthe plated via structure 110 to reduce or remove the stub 170 is onemethod to reduce the stub effect. Backdrilling is a viable alternativeto sequential layer processing but has limitations. Typically, a drillbit backdrills the stub 170 thereby removing a portion of theunnecessary excess conductive material of the plated via structure 110.A backdrilled hole 200 is created once the drill bit removes a portionof the stub 170 from the plated via structure 110. The drill bit iscommonly a carbide drill bit in a computer numerically controlled (CNC)drill machine. As a result of backdrilling, the portion of the stub 170of the plated via structure 110 is removed, thereby reducing, but notcompletely eliminating, parasitic capacitance, parasitic inductance, andtime delay, which may interfere with signal integrity.

In most cases, design concessions need to be made to allow fordeviations in the accuracy of the drilling equipment. If thebackdrilling is inaccurate (e.g. too deep or off center), then afunctional portion of the plated via structure 110 may be removed andthe PCB 100 may be ruined. As a consequence, a new PCB 100 must bereconstructed and backdrilled. Thus, yields are reduced and costs areincreased.

The backdrilling process is also limited in the tolerances that can bereliably held. Backdrilling is typically only controllable to a depthtolerance of +/−5 mils. In many cases, further design concessions needto be made due to limitations in the strength and consistency of thelayers to allow for variations in the placement, width, and direction ofdrilling.

Yet another limitation is that many designs require the backdrilling ofmultiple plated via structures 110 where the stubs 170 may be atdifferent depths. This requires specialized programming of the drilltool files, which takes time and money to produce.

Further, backdrilling multiple plated via structures 110 typically is aserial process, so that the time needed to backdrill the PCB 100increases with the number of stubs 170. If any one of the stubs 170 isdrilled improperly, the PCB 100 may be ruined. Therefore, backdrilling anumber of stubs 170 increases the probability of damage to the PCB 100.

Another limitation is that many designs also require stubs to be removedfrom both surfaces of the PCB 100. This requires that the PCB 100 bereoriented during the backdrilling process, which further takes time,requires additional programming, and adds potential error to theaccuracy of the backdrilling process.

Further, drill bits are prone to breakage which reduces yields andrequires rework of the PCB 100. The process of reworking each individualplated via structure 110 adds cycle time and increases costs inproduction. Moreover, drill bits are expensive, which further drives upcosts.

One consequence of backdrilling is that the volume of the removed stubbarrel is not functional in the context of circuit routing. No othertrace or interconnect on any layer can pass through the volume of theremoved stub. Circuit traces need to be re-routed around such volumes.In most cases, additional layers need to be added to effectively routeall the traces in a given design and thus add to complexity and cost.

PCBs can be split into two or more sections to reduce stub lengths orincrease wiring density using methods known in the art such assequential processing techniques. With sequential processing, twoseparate PCB subassemblies are individually manufactured. The twosubassemblies are subsequently laminated together and through-holes orvias are plated to connect the two individual PCBs into one. Stubs canbe controlled in this manner, but are limited to the layers between thetwo individual sub-assemblies. Because of the “sequential nature” ofsuch a lamination process, additional process steps are required andcost and cycle time to manufacture is significantly increased.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustration of a PCB with a plated via structure and astub in the prior art.

FIG. 2 is an illustration of the PCB with the plated via structure afterthe stub has been removed by backdrilling in the prior art.

FIG. 3 is an illustration depicting a PCB with a plated via structureformed through a plating resist, according to certain embodiments.

FIG. 4 is an illustration depicting a core sub-composite structurecovered with a layer of etch resist that is selectively exposed toelectromagnetic radiation, according to certain embodiments.

FIG. 5 is an illustration depicting the conducting layers and thedielectric layer of sub-composite structure with an area of altered etchresist, according to certain embodiments of the invention.

FIG. 6 is an illustration depicting the conducting layers and thedielectric layer of a sub-composite structure with the altered etchresist and a portion of the conducting layer removed to form a clearancein the conductive layer, according to certain embodiments.

FIG. 7 is an illustration depicting the conducting layers and thedielectric layer of sub-composite structure with the unaltered etchresist removed, according to certain embodiments.

FIG. 8 is an illustration depicting the conducting layers and thedielectric layer of a sub-composite structure with the plating resistdeposited within the clearance, according to certain embodiments.

FIG. 9 is an illustration depicting a PCB stackup with a partitionedplated via structure formed using a thicker layer of plating resist,according to certain embodiments.

FIG. 10 is an illustration depicting a PCB stackup with a partitionedplated via structure formed by selectively depositing plating resist ina clearance formed in a conducting layer and an adjacent dielectriclayer of a sub-composite structure, according to certain embodiments.

FIG. 11 is an illustration depicting a PCB stackup with a partitionedplated via structure formed by selectively depositing plating resist onthe surface of a sub-composite structure on an anti-pad region of thesurface that is coplanar with the top conducting layer of thesub-composite structure, according to certain embodiments.

FIG. 12 is an illustration depicting a PCB stackup with a partitionedplated via structure formed by selectively depositing plating resist ona conductive region or conductive pad on the surface of thesub-composite structure, according to certain embodiments.

FIG. 13 illustrates a cross-sectional view of a portion of a multilayerPCB stackup having an ideal gap formed within a plated through hole(PTH).

FIG. 14 illustrates a cross-sectional view of a portion of a practicalmultilayer PCB stackup having a gap formed within a plated through hole(PTH).

FIG. 15 illustrates a cross-sectional view of a portion of a multilayerPCB having a wide (longitudinal) gap/void/clearance formed within aplated through hole by using multiple points having plating resistmaterial in one or more dielectric layers.

FIG. 16 illustrates a cross-sectional view of a portion of a multilayerPCB having a wide (longitudinal) gap/void formed within a plated throughhole by using multiple points having plating resist material in one ormore dielectric layers.

FIG. 17 illustrates a cross-sectional view of a portion of anothermultilayer PCB having a wide (longitudinal) gap/void formed within aplated through hole by using multiple points having plating resistmaterial in one or more dielectric layers.

FIG. 18 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a wide (longitudinal) gap/void formed within aplated through hole by using multiple points having plating resistmaterial in one or more dielectric layers.

FIG. 19 illustrates a method for forming the PCBs of FIGS. 15, 16, 17,and/or 18. A first core or sub-composite structure is formed.

FIG. 20 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a wide (longitudinal) gap/void formed within aplated through hole by using multiple points having plating resistmaterial in one or more dielectric layers.

FIG. 21 illustrates a method for forming the PCB of FIG. 20.

FIG. 22 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a wide (longitudinal) gap/void formed within aplated through hole by using multiple points having plating resistmaterial including within at least a core or sub-composite structure.

FIG. 23 illustrates a method for forming an extended viagap/void/clearance in the multilayer PCB of FIG. 22.

FIG. 24 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a wide (longitudinal) gap/void formed within aplated through hole by using multiple points of plating resist materialwithin a single core or sub-composite structure.

FIG. 25 illustrates a method for forming an extended viagap/void/clearance in the multilayer PCB of FIG. 24.

FIG. 26 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a wide (longitudinal) gap/void formed within aplated through hole by using multiple points of plating resist materialwithin two different core or sub-composite structures.

FIG. 27 illustrates a method for forming an extended viagap/void/clearance in the multilayer PCB of FIG. 26.

FIG. 28 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a plurality of wide (longitudinal)gaps/voids/clearances formed within a plated through hole by usingmultiple points having plating resist material in one or more dielectriclayers.

FIG. 29 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB having a plurality of wide (longitudinal)gaps/voids/clearances formed within a plated through hole by usingmultiple points having plating resist material in a core orsub-composite structure and plating resist material in one or moredielectric layers.

FIG. 30 illustrates the formation of a wide gap/void within a platedthrough hole by using multiple points of plating resist material.

DETAILED DESCRIPTION OF THE INVENTION

A cost effective and efficient system to minimize signal degradation isto electrically isolate, reduce, or eliminate a stub by controlling theformation of a conductive material within a plated via structure of aprinted circuit board (PCB). One or more areas of plating resists withinthe via structure are used to resist the formation of conductivematerial by intentionally creating one or more voids in the viastructure. As a result, the formation of conductive material within thevia structure may be limited to those areas necessary for thetransmission of electrical signals. According to certain embodiments,the partitioning of the via structure into electrically isolatedsegments can dramatically increase the route capabilities or wiringdensity of a PCB design. This is because each electrically isolatedsegment of the partitioned via can be used to electrically connectsignals on layers associated that particular segment.

A multilayer PCB can be a chip substrate, a motherboard, a backplane, abackpanel, a centerplane, a flex or rigid flex circuit. The invention isnot restricted to use in PCBs. A via structure can be a platedthrough-hole used for transmitting electrical signals from oneconducting layer to another. A plated via structure can also be acomponent mounting hole for electrically connecting an electricalcomponent to other electrical components on the PCB.

The methods to electrically isolate, reduce, or eliminate a stub withinvia structures of PCBs may be faster and more efficient thanbackdrilling. Plating resists may be placed within the many clearancesin the conducting and/or dielectric layers of the PCB simultaneously. Inmost cases PCBs can have through-holes and vias in the order of 100,000plus. At the same time, the multi-layer PCB can have multiple layers. Itwould be advantageous to partition each of the vias and control the stubto variable degrees for each via. In other words, each via can bepartitioned at different layers and at different locations. To be ableto partition all the vias simultaneous on a single panel, plating resistcan be selectively deposited on a selected layer of each sub-compositecore during the making of the PCB stackup prior to drilling andsubsequent plating of the vias in the panel. For example, all theclearances within a layer of a PCB may be formed concurrently. Inanother example, the conductive material may be formed within all of thevia structures of a PCB at the same time. In contrast, as discussedpreviously, backdrilling is generally performed upon one via structureat a time. Thus, methods incorporating plating resists to limit stubformation may allow for faster production of PCBs than backdrilling.

FIG. 3 is an illustration depicting a PCB 300 with a plated viastructure 330 formed through a plating resist 370, according to certainembodiments. The PCB 300 includes conducting layers 310 a-310 eseparated by dielectric layers 320 a-320 e. The plated via structure 330is plated with a seed conductive material 390 and a further coating ofconductive material 392. The plated via 330 is effectively partitionedinto a plurality of electrically isolated portions (330 a, and 330 b) byselectively depositing plating resist in a sub-composite structure formaking the PCB stackup. A method of partitioning a plated via such asplated via 330 is described herein with reference to FIGS. 4 to 8.

FIG. 3 shows that the plated via allows an electrical signal 360 totransmit from one trace 340 or component mounting pad on a firstconducting layer 310 a to another trace 350 on a second conducting layer310 b of the PCB 300 by traversing the isolated portion 330 a of the via330. Similarly, the isolated portion 330 b of the via 330 allows anotherelectrical signal 362 to transmit to trace 380 without interfering withthe signal 360.

Plating resist is a generally nonconductive material deposited in one ormore clearances of conducting and dielectric layers. For example, inFIG. 3, plating resist is deposited in a clearance in the conductinglayer 310 d. When PCB 300 is placed in a seed or catalyzing bath, theseed will deposit on all areas of the via wall but will not deposit onthe plating resist. Should small amounts of seed be deposited on theplating resist, a post processing operation can be utilized to removethese residual deposits. Subsequently, when the panel is placed into anelectroless copper or electrolytic copper plating bath, copper willplate where there is seed or conductivity and will not plate or depositin the area where there is plating resist. The plating resist will forma cylindrical void that effectively partitions the barrel of the viainto segments.

The plating resist 370 prevents the deposition of the catalyzingmaterial 390 and conductive material 392 within the via structure 330 atthe conducting layer 310 d. As a result, via 330 is partitioned into theelectrically isolated portions 330 a, and 330 b. Consequently, theelectric signal 360 travels from the first conducting layer 310 a to thesecond conducting layer 310 b without signal integrity being degradedthrough interference caused by section 330 b. The conductive material392 of the plated via structure 330 is the medium through which theelectrical signal 360 travels from the first conducting layer 310 a ofthe PCB 300 to the second conducting layer 310 b. Similarly, electricsignal 362 traverses plated via 330 conductive layer 310 e. The platedvia structure 330 may be of any shape.

Some examples of the conductive or catalytic material 390 areelectroless copper, palladium seed. The catalytic seeding process canalso include electrophoretic plating, or direct metallization. Theplating process wherein the conductive material 392 such as conductivemetal, or copper is deposited within the via structure 330 may compriseelectrolytic plating, or an electroless process.

The PCB 300 can have any number of conducting layers and dielectriclayers. FIG. 3 only shows five layers of conducting layers 310 a-310 eand five layers of dielectric layers 320 a-320 e for the sake ofsimplicity. Each of the conducting layers 310 a-310 e may comprise apartial or full layer such as a power or ground layer, may comprise alayer of circuit traces, or may comprise a layer with both circuittraces and a partial layer such as a ground layer. A non-limitingexample of the conducting layers 310 a-310 e is copper. Somenon-limiting examples of dielectric layers 320 a-320 e are FR-4, epoxyglass, polyimide glass, ceramic hydrocarbon, polyimide film, resinimpregnated woven glass, film, resin impregnated matte material, Kevlar,paper, and resin dielectrics with dispersed nano-powders. According tocertain embodiments, the partitioned via is filled with an insulating orresistive paste to improve reliability or functionality.

A method of partitioning a plated via such as plated via 330 isdescribed herein with reference to FIGS. 4 to 8. As described furtherherein, a clearance is a hole that is within at least one conductinglayer 310 a-310 e and/or at least one dielectric layer 320 a-320 e. Forexample, a clearance may be formed in the conducting layer 310 e. Eachclearance has a radius greater than the plated via structure 330. Theformation of the clearances through an etching process is describedbelow with reference to FIGS. 4-8.

FIGS. 4-8 are examples depicting etching a clearance within theconducting layer 310 d, as well as the placement and deposition of theplating resist 370, according to certain embodiments of the invention.It is to be noted that the etching as described with reference to FIGS.4-8 would apply to both conductive layers of the sub-compositestructure. For purposes of simplicity, the etching is described withreference to one conductive layer (310 d) of FIG. 4-8. Further, forsimplicity, FIGS. 4-8 describes the selective deposition of platingresist on one location in a core sub-composite structure. However, it isunderstood that plating resist can be selectively deposited on multiplelocations in the sub-composite structure depending on the PCB design.Moreover, each sub-composite structure may have the plating resistselectively deposited on different layers than that of othersub-composite structures so as to achieve the desired PCB design bylaminating these various sub-composite structures to form the PCBstackup.

FIG. 4 is an illustration depicting a core sub-composite structurecovered with a layer of etch resist that is selectively exposed toelectromagnetic radiation, according to certain embodiments. FIG. 4shows sub-composite structure 402 (also referred to herein as a core)that includes a dielectric layer 320 d sandwiched between two conductinglayers 310 d, and 310 e. Conductive layer 310 d is covered with an etchresist 400. Portions of the etch resist is covered with a mask 410.

The etch resist 400 is any material that is applied to an area of theconducting layer 310 d to prevent reaction of that area during anelectromagnetic, chemical, or electrochemical etching process. The etchresist 400 may be processed by a lithographic process, by selectivedeposition, or by direct laser imaging. Some examples of etch resist 400are photoresist, organic material, dry film, sheet, paste, polymer thickfilm, and liquid.

Mask 410 is a film or plate that selectively covers an area to preventreaction of the covered area during the electromagnetic, chemical, orelectrochemical reaction. Some examples of the mask 410 are silver film,glass, or diazo film. Mask 410 may be positioned over the etch resist400 with a mask aligner (not depicted) which is configured to controlthe placement of the mask 410. The exposed portion of the etch resist400 is exposed to electromagnetic radiation 420, or a laser, asnon-limiting examples, and altered to make the exposed etch resistremovable while leaving the covered etch resist undisturbed. In the caseof using a laser, mask 410 is not needed.

FIG. 5 is an illustration depicting the conducting layers 310 d, 310 eand the dielectric layer 320 d of sub-composite structure 402 with anarea of altered etch resist 500, according to certain embodiments of theinvention. The electromagnetic radiation 420 (FIG. 4) has beenterminated and the mask 410 (FIG. 4) has been removed thereby exposingthe unaltered etch resist 400.

FIG. 6 is an illustration depicting the conducting layers 310 d, 310 eand the dielectric layer 320 b of sub-composite structure 402 with thealtered etch resist 500 (FIG. 5) and a portion of the conducting layer310 d removed to form a clearance 600 in the conducting layer 310 d,according to certain embodiments. The altered etch resist 500 (FIG. 5)has been removed by methods well known in the art thereby exposing aportion of the conducting layer 310 d. The exposed portion of theconducting layer 310 d is then etched to form the clearance 600 andexpose the dielectric layer 320 d. Clearance 600 can be in a ground orpower plane or in conductive pad or feature on a signal layer.

FIG. 7 is an illustration depicting the conducting layers 310 d, 310 eand the dielectric layer 320 d of sub-composite structure 402 with theunaltered etch resist 400 removed, according to certain embodiments. Theunaltered etch resist 400 (FIGS. 4-6) may be removed by methods wellknown in the art, thereby exposing the conducting layer 310 d.

FIG. 8 is an illustration depicting the conducting layers 310 d, 310 eand the dielectric layer 320 d of sub-composite structure 402 with theplating resist 870 deposited within the clearance 600, according tocertain embodiments.

For example, a plating resist can be deposited into a clearance usingprinting, stencil printing, needle dispensing, etc. The plating resistcan be a hydrophobic insulating material that is resistant to thedeposition of a catalytic species capable of catalyzing an electrolessmetal deposition. The plating resist can also be a material that resistsdeposition of other “seed” deposits such as colloidal graphite.

The plating resist can be deposited so as to be flush or higher than theetched clearance layer. The plating resist can be a paste or viscousliquid. Some non-limiting examples of plating resists are siliconeresins, polyethylene resins, fluorocarbon resins, polyurethane resins,and acrylic resins. Such insulating hydrophobic resinous material can beused alone or in a combined composition with other resinous materials inamounts sufficient to maintain hydrophobic properties in the combinedcomposition.

After depositing the plating resist, the plating resist is cured usingappropriate methods. The sub-composite structure 402 with plating resist870 in place can now be laminated to the rest of the multilayer PCBstackup using techniques well known in the art. Multiple sub-compositestructures (cores) with selectively deposited plating resist areas invarying locations can be laminated to form a PCB stackup. Through-holesare drilled through the PCB stackup through conductive layers,dielectric layers and through the plating resist.

Thus, the PCB panel has multiple through-holes that can then be platedsimultaneously by placing the panel into a seed bath, followed byimmersion in an electroless copper bath. A non-limiting example of aseed bath is copper palladium colloid. An example for surface platingcan be found in U.S. Pat. No. 4,668,532. The electroless copper providesthe initial conductivity path to allow for additional electrolyticcopper plating of the barrel of each through-hole in the panel. The seedchemistry (electroless copper) will deposit on the surface of thethrough-hole wall, but will not deposit effectively on areas of the wallwith the plating resist. A small amount of electroless copper maydeposit on the plating resist but such an amount can be removed with apost processing step known in the art. For example, any small amounts ofelectroless copper that may be deposited on the plating resist can beremoved by contacting the affected areas with a chelating agent in analkaline solution for a time period sufficient to remove essentially allof said catalytic species from the hydrophobic plating resist. The panelwill then follow known processes either for panel plating or patternplating. For example, electrolytic or electroless plating can be used.In other words, the interior walls of the through-holes are contactedwith a metal deposition solution to metallize only the exposed catalyticareas of the walls not protected by the hydrophobic plating resist.

Plating of conductive material in the via structure will build whereverthere is seed material. Similarly, no plating of conductive materialwill form where there is plating resist. Thus, the areas that are voidof plated conductive material in the via structure effectively partitionthe via into electrically isolated sections. By strategically placingplating resist in certain locations and on certain layers of a PCBstackup, multiple electrically isolated portions in via structures canbe formed, simultaneously.

Thus, the above method can be used to configure the via structure intomultiple electrically isolated segments. Each such segment providesinterconnect paths to appropriate layers within the PCB. Suchpartitioned vias can be subsequently filled with an insulating materiallike epoxy or other insulating or resistive polymer for improvedreliability or increased functionality. Therefore, costly, error prone,and time intensive backdrilling may be avoided. Similarly, referringback to FIG. 3. the use of the plating resist 370 avoids possible damageto the PCB 300 which may result by backdrilling. A further advantage isthat, whereas backdrilling is typically controllable to a depthtolerance of +/−5 mils, a controllable depth tolerance of +/−1 mils orbetter may be achieved by the systems and methods described herein. As aresult, the consistency between the plating resist 370, the dielectriclayers 320 b, and the conducting layer 310 c may be held to a tighterstandard deviation as compared to backdrilling.

According to certain embodiments, a thicker resist deposit may bepreferred. In such a case, the sub-composite structure or core ismechanically drilled with through-holes corresponding to areas wherepartitioned via structures are desired in the resulting PCB stackup. Thethickness of the sub-composite structure can range from about 1-50 mils.Thus, a thicker deposit of plating resist can be produced. Thethrough-holes are filled with plating resist using specialized holefilling equipment, stenciling or screen printing. Such a process isknown as hole-plugging or via-filling. The plating resist is then curedusing an appropriate process. A planarizing or scrubbing operation maybe employed to remove any excess plating resist from the surface of thesub-composite structure. The sub-composite structure can be processedusing standard PCB procedures to form circuit images. It is to be notedthat the through-holes can be filled with plating resist before or afterforming circuit images. The sub-composite structure can then belaminated into a multilayer PCB stackup and the process can continue asdescribed above for electroless seeding and subsequent plating of theinterior walls of the one or more via structures in the PCB stackup.According to certain embodiments, the partitioned via is filled with anelectrically insulating material, ohmically resistive paste or voltageswitchable dielectric material to improve reliability or functionality.In the case of using voltage switchable dielectric material,programmable circuit routing in PCBs can be made. Further, the voltageswitchable dielectric material can provide transient protection. Theterm “transient” as used herein encompasses not only electrostaticdischarge events but any phenomena, of short duration, that directly orindirectly induces voltages and currents into a printed circuit boardand where the amplitudes of such voltages and currents are high enoughto cause degradation or failure of the electronic components on theprinted circuit board.

FIG. 9 is an illustration depicting a PCB stackup with a partitionedplated via structure formed using a thicker layer of plating resist,according to certain embodiments. FIG. 9 shows a PCB 900 that includesconducting layers 910 a-910 f separated by dielectric layers 920 a-920f. The plated via structure 930 is plated with a seed conductivematerial 990 and a further coating of conductive material 992. Theplated via 930 is effectively partitioned into a plurality ofelectrically isolated portions (930 a, and 930 b) by selectivelydepositing plating resist in a sub-composite structure used for makingthe PCB stackup.

FIG. 9 shows that the partitioned plated via allows an electrical signal960 to transmit from one trace 940 on a first conducting layer 910 a toanother trace 950 on a second conducting layer 910 b of the PCB 900 bytraversing the isolated portion 930 a of the via 930 without signalintegrity being degraded through interference caused by portion 930 b.The conductive material 992 of the plated via structure 930 is themedium through which the electrical signal 960 travels from the firstconducting layer 910 a of the PCB 900 to the second conducting layer 910b. Similarly, the isolated portion 930 b of the via 930 allows anotherelectrical signal 962 to transmit to trace 980 without interfering withthe signal 960. The plating resist 970 prevents the deposition of theconductive material 990 and 992 within the via structure 930 at theconducting layers 910 c and 910 d. As a result, via 930 is effectivelypartitioned into the electrically isolated portions 930 a, and 930 b.

The PCB 900 can have any number of conducting layers and dielectriclayers. FIG. 9 only shows six layers of conducting layers 910 a-910 fand six layers of dielectric layers 920 a-920 f for the sake ofsimplicity. Each of the conducting layers 910 a-910 f may comprise apartial or full layer such as a power or ground layer, and may comprisea layer of circuit traces, or may comprise a layer with both circuittraces and a partial layer such as a ground layer. A non-limitingexample of the conducting layers 910 a-910 f is copper and somenon-limiting examples of dielectric layers 920 a-920 f are epoxy glass,polyimide glass, ceramic hydrocarbon, polyimide film, Teflon film, resinimpregnated matte material, Kevlar, paper, resin dielectrics withdispersed nano-powders.

According to certain embodiments, plating resist is selectivelydeposited in a clearance formed in a conducting layer and an adjacentdielectric layer of a sub-composite structure. In such a case, thesub-composite structure can be mechanically or laser drilled to form ablind hole. The blind hole starts at one conductive layer of thesub-composite structure, proceeds through the dielectric layer andterminates on another conductive layer of the sub-composite structure.However, the depth of the blind hole can be drilled to any depth shortof reaching the conductive layer of the sub-composite structure. Platingresist is then deposited into the blind hole using a squeegeeing,stenciling, or screen printing operation, for example. The resist isthen cured. A planarizing or scrubbing operation may be employed toremove resist from the open end of the blind hole. The sub-compositestructure can be processed using standard PCB procedures to form circuitimages. It is to be noted that the plating resist can be depositedbefore or after forming circuit images. The sub-composite structure canthen be laminated into a multilayer PCB stackup and the process cancontinue as described above for electroless seeding and subsequentplating of the interior walls of the via structure. The advantage insuch a via structure is that the plating resist does not come out of theblind end of the hole and a connection can be made to the undrilledconductive layer of the sub-composite structure (core). According tocertain embodiments, the partitioned via is filled with an electricallyinsulating material, ohmically resistive paste or voltage switchabledielectric material to improve reliability or functionality. In the caseof using voltage switchable dielectric material, programmable circuitrouting in PCBs can be made. Further, the voltage switchable dielectricmaterial can provide transient protection.

FIG. 10 is an illustration depicting a PCB stackup with a partitionedplated via structure formed by selectively depositing plating resist ina clearance formed in a conducting layer and an adjacent dielectriclayer of a sub-composite structure, according to certain embodiments.FIG. 10 shows a PCB 1000 that includes conducting layers 1010 a-1010 fseparated by dielectric layers 1020 a-1020 f. The plated via structure1030 is plated with a seed conductive material 1090 and a furthercoating of conductive material 1092. The plated via 1030 is effectivelypartitioned into a plurality of electrically isolated portions (1030 a,and 1030 b) by selectively depositing plating resist in a sub-compositestructure used for making the PCB stackup.

FIG. 10 shows that the partitioned plated via allows an electricalsignal 1060 to transmit from one trace 1040 on a first conducting layer1010 a to another trace 1050 on a different conducting layer 1010 c ofthe PCB 1000 by traversing the isolated portion 1030 a of the via 1030without signal integrity being degraded through interference caused byportion 1030 b. The conductive material 1092 of the plated via structure1030 is the medium through which the electrical signal 1060 travels fromthe first conducting layer 1010 a of the PCB 1000 to the anotherconducting layer 1010 c. Similarly, the isolated portion 1030 b of thevia 1030 allows another electrical signal 1062 to transmit to trace 1080without interfering with the signal 1060. The plating resist 1070prevents the deposition of the conductive material 1090 and 1092 withinthe via structure 1030 at the conducting layer 1010 d and the dielectriclayer 1020 c. As a result, via 1030 is effectively partitioned into theelectrically isolated portions 1030 a, and 1030 b.

The PCB 1000 can have any number of conducting layers and dielectriclayers. FIG. 10 only shows six layers of conducting layers 1010 a-1010 fand six layers of dielectric layers 1020 a-1020 f for the sake ofsimplicity. Each of the conducting layers 1010 a-1010 f may comprise apartial or full layer such as a power or ground layer, and may comprisea layer of circuit traces, or may comprise a layer with both circuittraces and a partial layer such as a ground layer. A non-limitingexample of the conducting layers 1010 a-1010 f is copper and somenon-limiting examples of dielectric layers 1020 a-1020 f are epoxyglass, polyimide glass, ceramic hydrocarbon, polyimide film, Teflonfilm, resin impregnated matte material, Kevlar, paper, resin dielectricswith dispersed nano-powders.

According to certain embodiments, plating resist is selectivelydeposited on the surface of a sub-composite structure on the exposeddielectric on the surface that is coplanar with the top conducting layerof the sub-composite structure. In such a case, the plating resist isdeposited onto an etched surface of a sub-composite core on the exposeddielectric. The plating resist is deposited onto the dielectric usingscreen printing, stenciling, needle depositing or other methods know inthe art. The thickness of the deposit of plating resist can be adjustedto a range up to 5 mils thick. [2 mils to 30 mils] The deposit ofplating resist can be any shape but typically would be round or squarein geometry. After deposition, the resist is cured using appropriateprocess. The sub-composite structure can be processed using standard PCBprocedures to form circuit images. It is to be noted that the platingresist can be deposited before or after forming circuit images. Thesub-composite structure can then be laminated into a multilayer PCBstackup and the process can continue as described above for electrolessseeding and subsequent plating of the interior walls of the viastructure. According to certain embodiments, the partitioned via isfilled with an electrically insulating material, ohmically resistivepaste or voltage switchable dielectric material to improve reliabilityor functionality. In the case of using voltage switchable dielectricmaterial, programmable circuit routing in PCBs can be made. Further, thevoltage switchable dielectric material can provide transient protection.

FIG. 11 is an illustration depicting a PCB stackup with a partitionedplated via structure formed by selectively depositing plating resist onthe surface of a sub-composite structure on the exposed dielectric,according to certain embodiments. FIG. 11 shows a PCB 1100 that includesconducting layers 1110 a-1110 e separated by dielectric layers 1120a-1120 e. The plated via structure 1130 is plated with a seed conductivematerial 1190 and a further coating of conductive material 1192. Theplated via 1130 is effectively partitioned into a plurality ofelectrically isolated portions (1130 a, and 1130 b) by selectivelydepositing plating resist in a sub-composite structure used for makingthe PCB stackup.

FIG. 11 shows that the partitioned plated via allows an electricalsignal 1160 to transmit from one trace 1140 on a first conducting layer1110 a to another trace 1150 on a different conducting layer 1110 c ofthe PCB 1100 by traversing the isolated portion 1130 a of the via 1130without signal integrity being degraded through interference caused byportion 1130 b. The conductive material 1192 of the plated via structure1130 is the medium through which the electrical signal 1160 travels fromthe first conducting layer 1110 a of the PCB 1100 to the anotherconducting layer 1110 c. Similarly, the isolated portion 1130 b of thevia 1130 allows another electrical signal 1162 to transmit to trace 1180without interfering with the signal 1160. The plating resist 1170prevents the deposition of the conductive material 1190 and 1192 withinthe via structure 1130 at an area between the conducting layer 1110 cand another conductive layer 1110 e. As a result, via 1130 iseffectively partitioned into the electrically isolated portions 1130 a,and 1130 b. The plated via structure 1130 may be of any shape.

The PCB 1100 can have any number of conducting layers and dielectriclayers. FIG. 11 only shows five layers of conducting layers 1110 a-1110e and five layers of dielectric layers 1120 a-1120 e for the sake ofsimplicity. Each of the conducting layers 1110 a-1110 e may comprise apartial or full layer such as a power or ground layer, and may comprisea layer of circuit traces, or may comprise a layer with both circuittraces and a partial layer such as a ground layer. A non-limitingexample of the conducting layers 1110 a-1110 e is copper and somenon-limiting examples of dielectric layers 1120 a-1120 e are epoxyglass, polyimide glass, ceramic hydrocarbon, polyimide film, Teflonfilm, resin impregnated matte material, Kevlar, paper, resin dielectricswith dispersed nano-powders.

According to certain embodiments, plating resist is selectivelydeposited on the surface of a sub-composite structure on a conductiveregion or conductive pad on the surface of the sub-composite structure.The conductive region could be patterned to be a plane or could be anindividual pad or feature. In the case of a pad or feature, the platingresist may overlap the pad. The plating resist is deposited onto theconductive region using screen printing, stenciling, needle depositingor other methods know in the art. The deposit of plating resist can beany shape but typically would be round or square in geometry. Afterdeposition, the resist is cured using appropriate process. Thesub-composite structure can be processed using standard PCB proceduresto form circuit images. It is to be noted that the plating resist can bedeposited before or after forming circuit images. The sub-compositestructure can then be laminated into a multilayer PCB stackup and theprocess can continue as described above for electroless seeding andsubsequent plating of the interior walls of the via structure. Accordingto certain embodiments, the partitioned via is filled with anelectrically insulating material, ohmically resistive paste or voltageswitchable dielectric material to improve reliability or functionality.In the case of using voltage switchable dielectric material,programmable circuit routing in PCBs can be made. Further, the voltageswitchable dielectric material can provide transient protection.

FIG. 12 is an illustration depicting a PCB stackup with a partitionedplated via structure formed by selectively depositing plating resist ona conductive region or conductive pad on the surface of thesub-composite structure, according to certain embodiments. FIG. 12 showsa PCB 1200 that includes conducting layers 1210 a-1210 e separated bydielectric layers 1220 a-1220 e. The plated via structure 1230 is platedwith a seed conductive material 1290 and a further coating of conductivematerial 1292. The plated via 1230 is effectively partitioned into aplurality of electrically isolated portions (1230 a, and 1230 b) byselectively depositing plating resist in a sub-composite structure usedfor making the PCB stackup.

FIG. 12 shows that the partitioned plated via allows an electricalsignal 1260 to transmit from one trace 1240 on a first conducting layer1210 a to another trace 1250 on the conducting pad 1210 d of the PCB1200 by traversing the isolated portion 1230 a of the via 1230 withoutsignal integrity being degraded through interference caused by portion1230 b. The conductive material 1292 of the plated via structure 1230 isthe medium through which the electrical signal 1260 travels from thefirst conducting layer 1210 a of the PCB 1200 to the conducting pad 1210d. Similarly, the isolated portion 1230 b of the via 1230 allows anotherelectrical signal 1262 to transmit to trace 1280 without interferingwith the signal 1260. The plating resist 1270 prevents the deposition ofthe conductive material 1290 and 1292 within the via structure 1230 atan area between the conducting layer 1210 e and the conducting pad 1210d. As a result, via 1230 is effectively partitioned into theelectrically isolated portions 1230 a, and 1230 b. The plated viastructure 1230 may be of any shape.

The PCB 1200 can have any number of conducting layers and dielectriclayers. FIG. 12 only shows five layers of conducting layers 1210 a-1210e and five layers of dielectric layers 1120 a-1120 e for the sake ofsimplicity. Each of the conducting layers 1210 a-1210 e may comprise apartial or full layer such as a power or ground layer, and may comprisea layer of circuit traces, or may comprise a layer with both circuittraces and a partial layer such as a ground layer. A non-limitingexample of the conducting layers 1210 a-1210 f is copper and somenon-limiting examples of dielectric layers 1220 a-1220 e are epoxyglass, polyimide glass, ceramic hydrocarbon, polyimide film, Teflonfilm, resin impregnated matte material, Kevlar, paper, resin dielectricswith dispersed nano-powders.

Due to the selective nature of the plating resist deposition andsimultaneous plating of the vias resulting in partitioned sections, viascan be subdivided into multiple sections each capable of carryingsignals without disturbing signals in other sections. To do soeffectively, a computer program is advantageous to use when designing aPCB layout. For example, the computer program would be patched to anECAD software such as Cadence Allegro™ or Mentor Expedition™ orSupermax™. The computer program can also run as a stand alone softwaremodule, which would import data from an ECAD system, partition the vias,then output appropriate files back to the ECAD or Computer AidedManufacturing (CAM) system. Such software can also output files to beused for programming manufacturing equipment to drill appropriate holesin selected cores and/or generate art work to manufacture stencils forselective deposition of the plating resist. Thus, by determining thelocations of the plating resist and location of the resultingpartitioned vias, a PCB design can be optimized to increase routingdensity and improve integrity. In the case of a pre-existing design of aPCB layout, the computer program can be used to identify locations forselective depositions of plating resist in locations that correlate tolocations for backdrilling, for example.

Wider Conductive Via Gaps Using Multiple Plating Resist Points

One shortcoming of some single plating resist gap/void approaches, likein FIG. 3, is that they are prone manufacturing defects (e.g.,electrical shorting). For example, as the layers in a multilayer PCBstackup get thinner, the thickness of the plating resist must also getthinner, increasing the probability that the conductive plating materialin a plated through hole (also referred to as a via) can short acrossthe plating resist material intended to case the gap/void.

FIG. 13 illustrates a cross-sectional view of a portion of a multilayerPCB stackup having an ideal gap formed within a plated through hole(PTH). The multilayer PCB stackup 1302 may include one or more coreand/or sub-composite structures 1312 a and 1312 b that are laminatedtogether to form the PCB stackup 1302. Each core and/or sub-compositestructure 1312 a and 1312 b may include one or more dielectric layersand/or one or more conductive layers that form a rigid, semi-rigid,semi-flexible, and/or flexible structure.

In one example, the structures 1312 a and/or 1312 b may be a corestructure 1315 (e.g., flexible, semi-flexible/semi-rigid, or rigid) thatinclude conductive layers (e.g., foils) 1320 a and 1320 b with adielectric material 1322 (e.g., prepreg) on one or both sides. Thedielectric material may be, for example, a prepreg, a bonding sheet,and/or sub-composite materials such as cured or partially cured resinand these may be impregnated with a reinforcement or reinforcingmaterial or aggregate. Cured or partially cured resin may include epoxy,polyimide, polyphenylene ether (PPO), cyanate ester, hydrocarbon,polytetrafluoroethylene (PTFE), bismaleimide triazine (BT), phenol resinor any resin that is used for printed circuit board dielectric materialas a pure or blended composition. Resin impregnated reinforcement may beused for the dielectric material 1322 and may include woven or unwovenglass fibers, Kevlar fibers, polyester fiber, carbon fiber, cellulosefiber or any other fiber that are used for printed circuit board. Whenunwoven reinforcement is used, this reinforcement may be fibers aschopped, powdered material, etc.

In a second example, the structures 1312 a and/or 1312 b may be a firstsub-composite structure 1317 (e.g., flexible, semi-flexible/semi-rigid,or rigid) that includes one or more conductive layers (e.g., foils) 1324a, 1324 b, 1324 c, and/or 1324 d, with one or more dielectric layers1326 a, 1326 b, and/or 1326 c in between. In this example, the compositestructure 1317 has conductive layers on the top and bottom surfaces.

In a third example, the structures 1312 a and/or 1312 b may be a secondsub-composite structure 1319 (e.g., flexible, semi-flexible/semi-rigid,or rigid) that includes one or more dielectric layers 1328 a, 1328 b,1328 c, 1328 d, and/or 1328 e with one or more conductive layers (e.g.,foils) 1330 a, 1330 b, 1330 c, and/or 1330 d in between. In thisexample, the composite structure 1319 has dielectric layers on the topand bottom surfaces.

In some examples, one or more of the conductive layers within thecore/sub-composite structures 1312 a and/or 1312 b may includeelectrical traces and/or pads that may have been formed by etching ofthe conductive layers 1320, 1324, and/or 1330.

In FIG. 13, plating resist 1304 has been deposited on a portion of thecore/sub-composite structure 1312 b. For instance, during the stackingprocess, the plating resist 1304 may have been deposited on a surface ofthe core/sub-composite structure 1312 b using, for example, screenprinting, stencil printing, ink jet, transfer printing or otherdeposition method. Note that the plating resist 1304 may be deposited ontop of either a conductive layer 1320 a, 1324 a or a dielectric layer1328 a.

A plated through-hole (PTH) 1316 may be formed through the stackup 1302including plating resist 1304 which may electrically couple one or moreconductive layers 1320, 1324, and/or 1330 of the core/sub-compositestructures 1312 a, 1312 b and/or electrical traces/pads formed on one ormore of the conductive layers. The plating resist 1304 prevents thedeposition of the conductive plating material within the PTH 1316 at theplating resist 1304. As a result, the PTH 1316 is effectivelypartitioned into the electrically isolated via segments 1308 and 1310.When the PTH 1316 is plated with an electrically conductive material,the two separate via segments 1308 and 1310 are formed, with a viagap/void/clearance 1318 being formed by the plating resist 1304.

However, FIG. 13 is an ideal situation, and does not illustrate theproblems often exhibited in real/practical PTH structures.

FIG. 14 illustrates a cross-sectional view of a portion of a practicalmultilayer PCB stackup having a gap formed within a plated through hole(PTH) 1416. The multilayer PCB stackup 1402 includes a plurality ofdielectric layers 1406 a, 1406 b, and 1406 c (e.g., prepreg layers) anda plurality of core or sub-composite structures 1412 a and 1412 b. Thecore or sub-composite structures 1412 a and 1412 b may be similar tothose of FIG. 13. In this example, plating resist 1404 has beendeposited on a first core/sub-composite structure 1412 b. When the PTH1416 is plated with an electrically conductive material, two separatevia segments 1408 and 1410 are formed, with a via gap/void/clearance1418 being formed by the plating resist 1404. As illustrated here, theremay be a wide thickness variance (e.g., between layers 1412 a and 1406b) due to uneven solid structure in 1406 b during the laminationprocess. Thus, at least one non-conductive/dielectric layer 1406 b mayneed to be sufficiently wide to accommodate thickness variances andlamination void concerns when multiple core or sub-composite structures1412 a and 1412 b are laminated together. In the meantime, many printedcircuit boards (PCB) have dielectric layer thickness constraints due toimpedance control, total thickness control and/or the other reasons.Then the PCB may face an unsolvable trade off. For instance, there isoften over hang conductive plating material extending over the platingresist 1404 due to isotropic electrolyte plating nature. This overhangconductive material shortens the width of the gap/void/clearance 1418,increasing the probability of a short between a first via segment 1408and a second via segment 1410. Even if a short is not present, the smallgap 1418 may be susceptible to current leakage and/or arcing. Due to therisk of shorting, leakage, arcing, and the uneven thickness ofdielectric layers, the non-conductive dielectric layers may have to bemade even wider. However, increasing the width of the plating resist1404 and/or dielectric layer 1406 b may not be an option due tothickness limitations (e.g., impedance controls, thickness controls,etc.).

FIGS. 15-29 illustrate various solutions to overcome the shortcomings ofthe single gap/void approach of FIGS. 13-14.

FIG. 15 illustrates a cross-sectional view of a portion of a multilayerPCB 1502 having a wide (longitudinal) gap/void/clearance 1518 formedwithin a plated through hole 1516 by using multiple points havingplating resist material 1504 and 1505 in one or more dielectric layers1506 a and 1506 b. Within the multilayer PCB 1502, thegap/void/clearance 1518 may be formed between the two plating resistmaterials 1504 and 1505. The multilayer PCB 1502 may also includeadditional dielectric, core structure, and/or sub-composite structurelayers 1512 a, 1512 b, and 1512 c. The first plating resist material1504 and 1505 may comprise an insulating hydrophobic resinous materialresistant to deposition of a catalytic species capable of catalyzing anelectroless metal deposition. The first via segment 1504 and second viasegment 1505 may be separated along a circumference of the partitionedplated through hole 1516.

In another example, the first and second plating resist may composereduced surface area of drill hole surface compared with the materialsused in the printed circuit board that effectively prevent depositionand/or allow to remove electrolyte plating seeds. In another example, achemical or physical process may be used to remove electrolyte platingseeds using chemical or physical bonding force difference betweenplating resin surface and other area.

In one example, a first thickness of the first plating resist material1504 may be less than a second thickness of a first dielectric layer1506 a. Similarly, a third thickness of the second plating resistmaterial 1505 may be less than a fourth thickness of a second dielectriclayer 1506 b.

In another example, the first thickness of the first plating resistmaterial 1504 is approximately the same as the second thickness of thefirst dielectric layer 1506 a.

In one example, the core or sub-composite structure 1512 a, 1512 b,and/or 1512 c may include at least one power plane and/or at least one aground plane.

FIG. 16 illustrates a cross-sectional view of a portion of a multilayerPCB 1602 having a wide (longitudinal) gap/void 1618 formed within aplated through hole 1616 by using multiple points having plating resistmaterial 1604 and 1605 in one or more dielectric layers 1606 b and 1606c. The multilayer PCB 1602 may include a plurality of dielectric layers1606 a, 1606 b, 1706 c, and/or 1606 d, a plurality of core orsub-composite structures 1612 a and/or 1612 b, and/or one or moredielectric, core, and/or sub-composite structure layers 1614. Within themultilayer PCB 1602, the gap/void/clearance 1618 may be formed betweenthe two plating resist materials 1604 and 1605. In this example, theplating resist material 1604 and 1605 has been deposited on a firstsurface of a first core or sub-composite structure 1612 a and a secondsurface of a second core or sub-composite structure 1612 b. Themultilayer PCB 1602 may also include additional dielectric, corestructure, and/or sub-composite structure layers 1614 between theplating resist material 1604 and 1605. Additionally, a first dielectriclayer 1606 a may be placed on a second surface of the first core orsub-composite structure 1612 a and a second dielectric layer 1606 b maybe placed on a first surface of the second core or sub-compositestructure 1612 b.

In one example, the structures 1612 a, 1612 b, and/or 1614 may be a corestructure 1615 (e.g., flexible, semi-flexible/semi-rigid, or rigid) thatinclude conductive layers (e.g., foils) 1620 a and 1620 b placed oneither side of a dielectric material 1622 (e.g., prepreg). Thedielectric material may be, for example, a prepreg, a bonding sheet,and/or sub-composite materials such as cured or partially cured resinand these may be impregnated with a reinforcement or reinforcingmaterial or aggregate. Cured or partially cured resin may include epoxy,polyimide, polyphenylene ether (PPO), cyanate ester, hydrocarbon,polytetrafluoroethylene (PTFE), bismaleimide triazine (BT), phenol resinor any resin that is used for printed circuit board dielectric materialas a pure or blended composition. Resin impregnated reinforcement may beused for the dielectric material 1622 and may include woven or unwovenglass fibers, Kevlar fibers, polyester fiber, carbon fiber, cellulosefiber or any other fiber that are used for printed circuit board. Whenunwoven reinforcement is used, this reinforcement may be fibers aschopped, powdered material, etc.

In a second example, the structures 1612 a, 1612 b, and/or 1614 may be afirst sub-composite structure 1617 (e.g., flexible,semi-flexible/semi-rigid, or rigid) that includes one or more conductivelayers (e.g., foils) 1624 a, 1624 b, 1624 c, and/or 1624 d, with one ormore dielectric layers 1626 a, 1626 b, and/or 1626 c in between. In thisexample, the composite structure 1617 has conductive layers on the topand bottom surfaces.

In a third example, the structures 1612 a, 1612 b, and/or 1614 may be asecond sub-composite structure 1619 (e.g., flexible,semi-flexible/semi-rigid, or rigid) that includes one or more dielectriclayers 1628 a, 1628 b, 1628 c, 1628 d, and/or 1628 e with one or moreconductive layers (e.g., foils) 1630 a, 1630 b, 1630 c, and/or 1630 d inbetween. In this example, the composite structure 1619 has dielectriclayers on the top and bottom surfaces.

In some examples, one or more of the conductive layers within thecore/sub-composite structures 1612 a and/or 1612 b may includeelectrical traces and/or pads that may have been formed by etching ofthe conductive layers 1620, 1624, and/or 1630.

FIG. 17 illustrates a cross-sectional view of a portion of anothermultilayer PCB 1702 having a wide (longitudinal) gap/void 1718 formedwithin a plated through hole 1716 by using multiple points havingplating resist material 1704 and 1705 in one or more dielectric layers1706 b and 1706 d. The multilayer PCB 1702 may include a plurality ofdielectric layers 1706 a, 1706 b, 1706 c, 1706 d, and/or 1706 e, aplurality of core or sub-composite structures 1712 a and/or 1712 b,and/or one or more dielectric, core, and/or sub-composite structurelayers 1714 a and/or 1714 b. Within the multilayer PCB 1702, thegap/void/clearance 1718 may be formed between the two plating resistmaterials 1704 and 1705. In this example, the plating resist materialhas been deposited on a first surface of a first core or sub-compositestructure 1712 a and a first surface of a second core or sub-compositestructure 1712 b. The multilayer PCB 1702 may also include additionaldielectric, core structure, and/or sub-composite structure layers 1714 abetween the plating resist material 1704 and 1705. Additionally, a firstdielectric layer 1706 a may be placed on a second surface of the firstcore or sub-composite structure 1712 a and a second dielectric layer1706 c may be placed on a second surface of the second core orsub-composite structure 1712 b.

A perspective view 1717 of a portion of the multilayer PCB 1702 alsoillustrates that, in one example, the plating resist 1704 may bedeposited on only a portion of the core or sub-composite structure 1712a corresponding to the location through which the PTH 1716 is to beplaced. For instance, plating resist 1704 may be deposited in a regionslightly larger than the hole to be formed/drilled for the PTH 1716. Asa result, the plating resist 1704 and/or 1705 may be deposited on onlyselected regions or portions of the core or sub-composite structure 1712a and/or 1712 b rather than on the whole surface of the core orsub-composite structure 1712 a and/or 1712 b. Consequently, in oneexample, the first plating resist 1704 and/or second plating resist 1705may have a radius/diameter greater than a radius/diameter of the throughhole.

FIG. 18 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 1802 having a wide (longitudinal) gap/void 1818 formedwithin a plated through hole 1816 by using multiple points havingplating resist material 1804 and 1805 in one or more dielectric layers1806 a and 1806 d. The multilayer PCB 1802 may include a plurality ofdielectric layers 1806 a, 1806 b, 1806 c, 1806 d, and/or 1806 e, aplurality of core or sub-composite structures 1812 a and/or 1812 b,and/or one or more dielectric, core, and/or sub-composite structurelayers 1814 a and/or 1814 b. In this example, the plating resistmaterial has been deposited on a first surface of a first core orsub-composite structure 1812 a and a second surface of a second core orsub-composite structure 1812 b. The multilayer PCB 1802 may also includeadditional dielectric, core structure, and/or sub-composite structurelayers 1814 a between the plating resist material 1804 and 1805. Whenthe plated through hole 1816 is formed through the multilayer PCB 1802,an interior surface of a through hole is plated with a conductivematerial except along a length/gap/void/clearance 1818 between the firstplating resist material 1804 and the second plating resist material 1805to form the partitioned plated through hole 1816 having a first viasegment 1808 electrically isolated from a second via segment 1810.

Note that to avoid plating across an intermediate core or sub-compositestructure 1812 a, 1814 a, and/or 1812 b, those intermediate core orsub-composite structures may not form an electrical current path (e.g.,it is not coupled to ground or power) during the plating process,thereby inhibiting plating material from depositing along the thicknessof the intermediate core or sub-composite structures 1812 a, 1814 a,and/or 1812 b in the through hole.

FIG. 19 illustrates a method for forming the PCBs of FIGS. 15, 16, 17,and/or 18. A first core or sub-composite structure is formed 1902. Forinstance, the first core or sub-composite structure may be the core orsub-composite structure 1512 a (FIG. 15), 1612 a (FIG. 16), 1712 a (FIG.17), and/or 1812 a (FIG. 18). At least one conductive layer of the firstcore or sub-composite structure may be etched to form via pads,antipads, and/or electrical traces 1904. For instance, such etching mayserve to form electrical paths to/from points where vias are to beformed. A first plating resist material may then be deposited on atleast one surface of the first core or sub-composite structure 1906. Forinstance, the first plating resist may be the plating resist 1504 (FIG.15) on the bottom surface of the core or sub-composite structure 1512 a(FIG. 15), plating resist 1604 (FIG. 16) on the bottom surface of thecore or sub-composite structure 1612 a (FIG. 16), plating resist 1704(FIG. 17) on the bottom surface of the core or sub-composite structure1712 a (FIG. 17), and/or plating resist 1804 (FIG. 18) on the topsurface of the core or sub-composite structure 1812 a (FIG. 18).

Similarly, a second core or sub-composite structure is formed 1908. Forinstance, the second core or sub-composite structure may be the core orsub-composite structure 1512 c (FIG. 15), 1612 b (FIG. 16), 1712 b (FIG.17), and/or 1812 b (FIG. 18). At least one conductive layer of the firstcore or sub-composite structure may be etched to form via pads,antipads, and/or electrical traces 1910. For instance, such etching mayserve to form electrical paths to/from points where vias are to beformed. A second plating resist material may then be deposited on atleast one surface of the second core or sub-composite structure 1912.For instance, the second plating resist may be the plating resist 1505(FIG. 15) on the top surface of the core or sub-composite structure 1512c (FIG. 15), plating resist 1605 (FIG. 16) on the top surface of thecore or sub-composite structure 1612 b (FIG. 16), plating resist 1705(FIG. 17) on the bottom surface of the core or sub-composite structure1712 b (FIG. 17), and/or plating resist 1805 (FIG. 18) on the bottomsurface of the core or sub-composite structure 1812 b (FIG. 18).

The first core or sub-composite structure and second core orsub-composite structure may then be laminated with at least onedielectric layer in between 1914. A through hole may then be formedthrough first core or sub-composite structure, the second core orsub-composite structure, the at least one dielectric layer, and throughthe first plating resist and the second plating resist 1916. An interiorsurface of the through hole may be plated with a conductive materialexcept along a length between the first plating resist and the secondplating resist to form a partitioned plated through hole having a firstvia segment electrically isolated from a second via segment 1918. Forinstance, the plated through hole may be the plated through hole 1516,1616, 1716, and/or 1816. That is, as a result of the positioning of thefirst and second plating resist materials (such as 1504/1505 in FIG. 15,1604/1605 in FIG. 16, 1704/1705 in FIG. 17, and/or 1804/1805 in FIG.18), plating material does not adhere to the region between the firstand second plating resist materials, thereby creating avoid/gap/clearance along the plated through hole.

FIG. 20 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 2002 having a wide (longitudinal) gap/void 2018 formedwithin a plated through hole 2016 by using multiple points havingplating resist material 2004 and 2005 in one or more dielectric layers2006 b and 2006 c. The multilayer PCB 2002 may include a plurality ofdielectric layers 2006 a, 2006 b, 2006 c, and/or 2006 d, a plurality ofcore or sub-composite structures 2012 a, 2012 b, and/or 2012 c. Withinthe multilayer PCB 2002, the gap/void/clearance 2018 may be formedbetween the two plating resist materials 2004 and 2005. In this example,the plating resist material has been deposited on a first surface of afirst core or sub-composite structure 2012 b and a second surface of thefirst core or sub-composite structure 2012 b. Subsequently, when theplated through hole 2016 is formed through the multilayer PCB 2002, aninterior surface of a through hole is plated with a conductive materialexcept along a length/gap/void/clearance 2018 between the first platingresist material 2004 and the second plating resist material 2005 to formthe partitioned plated through hole 2016 having a first via segment 2008electrically isolated from a second via segment 2010.

Note that to avoid plating across the intermediate core or sub-compositestructure 2012 b, that intermediate core or sub-composite structure 2012b may not form an electrical current path (e.g., it is not coupled toground or power) during the plating process, thereby inhibiting platingmaterial from depositing along the thickness of the intermediate core orsub-composite structure 2012 b in the through hole.

FIG. 21 illustrates a method for forming the PCB of FIG. 20. A firstcore or sub-composite structure is formed 2102. For instance, the firstcore or sub-composite structure may be the core or sub-compositestructure 2012 b (FIG. 20). At least one conductive layer of the firstcore or sub-composite structure may be etched to form via pads,antipads, and/or electrical traces 2104. For instance, such etching mayserve to form electrical paths to/from points where vias are to beformed. A first plating resist material may then be deposited on a firstsurface of the first core or sub-composite structure 2106. For instance,the first plating resist may be the plating resist 2004 (FIG. 20) on thetop surface of the core or sub-composite structure 2012 b (FIG. 20). Asecond plating resist material may then be deposited on a second surfaceof the first core or sub-composite structure 2108. For instance, thesecond plating resist may be the plating resist 2005 (FIG. 20) on thebottom surface of the core or sub-composite structure 2012 b (FIG. 20).

The first core or sub-composite structure may then be laminated to oneor more dielectric layers and/or other core or sub-composite structures2110. A through hole may then be formed through first core orsub-composite structure, the one or more dielectric layers, the othercore or sub-composite structures, and through the first plating resistand the second plating resist 2112. An interior surface of the throughhole may be plated with a conductive material except along a lengthbetween the first plating resist and the second plating resist to form apartitioned plated through hole having a first via segment electricallyisolated from a second via segment 2114. That is, as a result of thepositioning of the first and second plating resist materials (such as2004 and 2005 in FIG. 20), plating material does not adhere to theregion between the first and second plating resist materials, therebycreating a void/gap/clearance along the plated through hole.

FIG. 22 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 2202 having a wide (longitudinal) gap/void 2218 formedwithin a plated through hole 2216 by using multiple points havingplating resist material 2204 and 2205 including within at least a coreor sub-composite structure. The multilayer PCB 2202 may include aplurality of dielectric layers 2206 a, 2206 b, 2206 c, and/or 2206 d, aplurality of core or sub-composite structures 2212 a, 2212 b, and/or2212 c. Within the multilayer PCB 2202, the gap/void/clearance 2218 maybe formed between the two plating resist materials 2204 and 2205. Inthis example, a first plating resist material 2204 has been deposited ona first surface of a first core or sub-composite structure 2212 a. Forinstance, the first plating resist material 2204 may be deposited on aconductive layer or conductive pad/trace 2214 a that is part of thefirst core or sub-composite structure 2212 a. A second plating resistmaterial 2205 may be deposited within a second core or sub-compositestructure 2212 b. For instance, the second plating resist material 2205may be deposited within a conductive or dielectric layer of the secondcore or sub-composite structure 2212 b while such structure is beingformed. Subsequently, when the plated through hole 2216 is formedthrough the multilayer PCB 2202, an interior surface of a through holeis plated with a conductive material except along alength/gap/void/clearance 2218 between the first plating resist material2204 and the second plating resist material 2205 to form the partitionedplated through hole 2216 having a first via segment 2208 electricallyisolated from a second via segment 2210.

In one example, the first core or sub-composite structure 2212 b may bea flexible, semi-flexible/semi-rigid, or rigid structure that includesconductive layers (e.g., foils) 2220 a and 2220 b placed on either sideof a dielectric material 2222 (e.g., prepreg). The dielectric materialmay be, for example, a prepreg, a bonding sheet, and/or sub-compositematerials such as cured or partially cured resin and these may beimpregnated with a reinforcement or reinforcing material or aggregate.Cured or partially cured resin may include epoxy, polyimide,polyphenylene ether (PPO), cyanate ester, hydrocarbon,polytetrafluoroethylene (PTFE), bismaleimide triazine (BT), phenol resinor any resin that is used for printed circuit board dielectric materialas a pure or blended composition. Resin impregnated reinforcement may beused for the dielectric material 2222 and may include woven or unwovenglass fibers, Kevlar fibers, polyester fiber, carbon fiber, cellulosefiber or any other fiber that are used for printed circuit board. Whenunwoven reinforcement is used, this reinforcement may be fibers aschopped, powdered material, etc. The second plating resist material 2205may be deposited within dielectric layer 2222.

In a second example, the first core or sub-composite structure 2212 amay be a flexible, semi-flexible/semi-rigid, or rigid structure thatincludes one or more conductive layers (e.g., foils) 2224 a, 2224 b,2224 c, and/or 2224 d, with one or more dielectric layers 2226 a, 2226b, and/or 2226 c in between. In this example, the composite structure2217 has conductive layers on the top and bottom surfaces. The secondplating resist material 2205 may be deposited within a dielectric layer2226 b.

In a third example, the first core or sub-composite structure 2212 a maybe a flexible, semi-flexible/semi-rigid, or rigid structure thatincludes one or more dielectric layers 2228 a, 2228 b, 2228 c, 2228 d,and/or 2228 e with one or more conductive layers (e.g., foils) 2230 a,2230 b, 2230 c, and/or 2230 d in between. In this example, the compositestructure 1619 has dielectric layers on the top and bottom surfaces. Thesecond plating resist material 2205 may be deposited within dielectriclayer 2228 c.

In some examples, one or more of the conductive layers within thecore/sub-composite structures 2212 a and/or 2212 b may includeelectrical traces and/or pads that may have been formed by etching ofthe conductive layers 2220, 2224, and/or 2230.

FIG. 23 illustrates a method for forming an extended viagap/void/clearance in the multilayer PCB of FIG. 22. At least oneconductive layer may be etched to form via pads, antipads, and/orelectrical traces 2302. A first plating resist 2205 may be deposited ona first surface of the least one conductive layer 2304. A first core orsub-composite structure 2212 b may then be formed that incorporates theleast one conductive layer and one or more conductive layers and/ordielectric layers 2306. A second core or sub-composite structure 2212 amay also be that incorporates one or more conductive layers and/ordielectric layers 2308. A second plating resist may also be deposited ona surface of the second core or sub-composite structure 2310.

The first core or sub-composite structure 2212 b, second core orsub-composite structure 2212 a, and/or one or more dielectric layersand/or other core or sub-composite structures may then be laminatedtogether 2312 in one or more steps. A through hole may be formed throughthe first core or sub-composite structure, the second core orsub-composite structure, the one or more dielectric layers and/or othercore or sub-composite structures, and through the first plating resistand the second plating resist 2314. An interior surface of the throughhole may be plated with a conductive material except along a lengthbetween the first plating resist and the second plating resist to form apartitioned plated through hole having a first via segment electricallyisolated from a second via segment 2316.

FIG. 24 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 2402 having a wide (longitudinal) gap/void 2418 formedwithin a plated through hole 2416 by using multiple points of platingresist material 2404 and 2405 within a single core or sub-compositestructure. The multilayer PCB 2402 may include a plurality of dielectriclayers 2406 a, 2406 b, 2406 c, and/or 2406 d, a plurality of core orsub-composite structures 2412 a, 2412 b, and/or 2412 c. Within themultilayer PCB 2402, the gap/void/clearance 2418 may be formed betweenthe two plating resist materials 2404 and 2405. In this example, a firstplating resist material 2404 has been deposited on a first surface of afirst core or sub-composite structure 2412 b. For instance, the firstplating resist material 2404 may be deposited on a conductive layer orconductive pad/trace 2414 a that is part of the first core orsub-composite structure 2412 b. A second plating resist material 2405may be deposited on a second surface of the first core or sub-compositestructure 2412 a. For instance, the second plating resist material 2405may be deposited within a conductive or dielectric layer of the firstcore or sub-composite structure 2412 b while such structure is beingformed. Subsequently, when the plated through hole 2416 is formedthrough the multilayer PCB 2402, an interior surface of a through holeis plated with a conductive material except along alength/gap/void/clearance 2418 between the first plating resist material2404 and the second plating resist material 2405 to form the partitionedplated through hole 2416 having a first via segment 2408 electricallyisolated from a second via segment 2410.

FIG. 25 illustrates a method for forming an extended viagap/void/clearance in the multilayer PCB of FIG. 24. At least oneconductive layer may be etched to form via pads, antipads, and/orelectrical traces 2502. A first plating resist 2404 may be deposited ona first conductive layer 2504. A second plating resist 2405 may bedeposited on a first conductive layer 2506. A first core orsub-composite structure 2412 b may then be formed that incorporates theleast one conductive layer, the first conductive layer, the secondconductive layer, and/or one or more conductive layers and/or dielectriclayers 2508.

The first core or sub-composite structure 2412 b, and/or one or moredielectric layers and/or other core or sub-composite structures may thenbe laminated together 2510 in one or more steps. A through hole may beformed through the first core or sub-composite structure, the one ormore dielectric layers, and/or other core or sub-composite structures,and through the first plating resist and the second plating resist 2512.An interior surface of the through hole may be plated with a conductivematerial except along a length between the first plating resist and thesecond plating resist to form a partitioned plated through hole having afirst via segment electrically isolated from a second via segment 2514.

FIG. 26 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 2602 having a wide (longitudinal) gap/void 2618 formedwithin a plated through hole 2616 by using multiple points of platingresist material 2604 and 2605 within two different core or sub-compositestructures. The multilayer PCB 2602 may include a plurality ofdielectric layers 2606 a, 2606 b, 2606 c, and/or 2606 d, a plurality ofcore or sub-composite structures 2612 a, 2612 b, and/or 2612 c. Withinthe multilayer PCB 2602, the gap/void/clearance 2618 may be formedbetween the two plating resist materials 2604 and 2605. In this example,a first plating resist material 2604 has been deposited on a firstsurface of a first core or sub-composite structure 2612 a. For instance,the first plating resist material 2604 may be deposited on a conductivelayer or conductive pad/trace 2614 a that is part of the first core orsub-composite structure 2612 a. A second plating resist material 2605may be deposited on a second surface of the second core or sub-compositestructure 2612 b. For instance, the second plating resist material 2605may be deposited within a conductive or dielectric layer of the secondcore or sub-composite structure 2612 b while such structure is beingformed. Subsequently, when the plated through hole 2616 is formedthrough the multilayer PCB 2602, an interior surface of a through holeis plated with a conductive material except along alength/gap/void/clearance 2618 between the first plating resist material2604 and the second plating resist material 2605 to form the partitionedplated through hole 2616 having a first via segment 2608 electricallyisolated from a second via segment 2610.

FIG. 27 illustrates a method for forming an extended viagap/void/clearance in the multilayer PCB of FIG. 26. At least oneconductive layer may be etched to form via pads, antipads, and/orelectrical traces 2702. A first plating resist 2604 may be deposited ona first conductive layer 2704. A first core or sub-composite structure2612 a may then be formed that incorporates the least one conductivelayer, the first conductive layer, and/or one or more conductive layersand/or dielectric layers 2706.

A second plating resist 2605 may be deposited on a second conductivelayer 2708. A second core or sub-composite structure 2612 b may then beformed that incorporates the first conductive layer, and/or one or moreconductive layers and/or dielectric layers 2710.

The first core or sub-composite structure 2612 a, second core orsub-composite structure 2612 b, and/or one or more dielectric layersand/or other core or sub-composite structures may then be laminatedtogether 2712 in one or more steps. A through hole may be formed throughthe first core or sub-composite structure, the first core orsub-composite structure, the one or more dielectric layers, and/or othercore or sub-composite structures, and through the first plating resistand the second plating resist 2714. An interior surface of the throughhole may be plated with a conductive material except along a lengthbetween the first plating resist and the second plating resist to form apartitioned plated through hole having a first via segment electricallyisolated from a second via segment 2716.

FIG. 28 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 2802 having a plurality of wide (longitudinal)gaps/voids/clearances 2818 a and 2818 b formed within a plated throughhole 2816 by using multiple points having plating resist material 2804,2805, 2807, and 2809 in one or more dielectric layers 2806 b and 2806 c.The multilayer PCB 2802 may include a plurality of dielectric layers2806 a, 2806 b, 2806 c, and/or 2806 d, a plurality of dielectric layers,core structures, or sub-composite structures 2812 a, 2812 b, and/or 2812c. Within the multilayer PCB 2802, the gaps/voids/clearances 2818 a and2818 b may be formed between the two plating resist materials 2804/2805or 2807/2809, respectively. In one example, plating resist material2804/2805 has been deposited on a first core or sub-composite structure2812 a and a first surface of a second core or sub-composite structure2812 b, respectively. Similarly, plating resist material 2807/2809 hasbeen deposited on a second surface of the second core or sub-compositestructure 2812 b and on a third core or sub-composite structure 2812 c,respectively. Subsequently, when the plated through hole 2816 is formedthrough the multilayer PCB 2802, an interior surface of a through holeis plated with a conductive material except along a firstlength/gap/void/clearance 2818 a between a first plating resist material2804 and a second plating resist material 2805, and a secondlength/gap/void/clearance 2818 b between a third plating resist material2807 and a fourth plating resist material 2809 to form the partitionedplated through hole 2816 having a first via segment 2808, a second viasegment 2814, and a third via segment 2810, electrically isolated fromone another.

Note that the via segmentation process illustrated in FIG. 28 serves toform an internal or embedded via segment 2814 in a single platingprocess and without any additional processing after lamination of themultilayer PCB 2802. This internal or embedded via segment 2814 may beformed even when the first via segment 2808 and/or second via segment2810 are not formed.

FIG. 29 illustrates a cross-sectional view of a portion of yet anothermultilayer PCB 2902 having a plurality of wide (longitudinal)gaps/voids/clearances 2918 a and 2918 b formed within a plated throughhole 2916 by using multiple points having plating resist material 2904in a core or sub-composite structure and plating resist material 2905,2907, and 2909 in one or more dielectric layers 2906 b and 2906 c. Themultilayer PCB 2902 may include a plurality of dielectric layers 2906 a,2906 b, 2906 c, and/or 2906 d, a plurality of dielectric layers, corestructures, or sub-composite structures 2912 a, 2912 b, and/or 2912 c.Within the multilayer PCB 2902, the gaps/voids/clearances 2918 a and2918 b may be formed between the two plating resist materials 2904/2905or 2907/2909, respectively. In one example, a first plating resist 2904has been deposited within a first core or sub-composite structure 2912 aand a second plating resist 2905 has been deposited on a first surfaceof a second core or sub-composite structure 2912 b. Similarly, a thirdplating resist material 2907 has been deposited on a second surface ofthe second core or sub-composite structure 2912 b and a fourth platingresist has been deposited on a first surface of a third core orsub-composite structure 2912 c. Subsequently, when the plated throughhole 2916 is formed through the multilayer PCB 2902, an interior surfaceof a through hole is plated with a conductive material except along afirst length/gap/void/clearance 2918 a between the first plating resist2904 and the second plating resist 2905, and a secondlength/gap/void/clearance 2918 b between the third plating resist 2907and the fourth plating resist 2909 to form the partitioned platedthrough hole 2916 having a first via segment 2908, a second via segment2914, and a third via segment 2910, electrically isolated from oneanother.

FIG. 30 illustrates the formation of a wide gap/void within a platedthrough hole by using multiple points of plating resist material. First,a core structure or sub-composite structure 3002 may be formed. In oneexample, the core structure or sub-composite structure 3002 may be corestructure 3006 having two conductive layers with a dielectric inbetween. In another example, the core structure or sub-compositestructure 3002 may be a first sub-composite structure A 3008 or a secondsub-composite structure B 3010, each comprising a plurality ofconductive layers and dielectric layers.

A plating resist material 3004 may then be deposited on at least onesurface of the core structure or sub-composite structure 3002. Forinstance, the plating resist material 3004 may be deposited up to aparticular thickness and within a defined area or region (e.g., insteadof across the whole layer. The defined area or region may correspond toan area through which a hole for a via is to pass.

A first dielectric material 3012 may then be deposited or laminated onone or both surfaces of the core structure or sub-composite structure3002. The thickness of the first dielectric material 3012 may be atleast as thick or thicker than a thickness of the plating resistmaterial 3004. In this manner, a single plating resist material 3004 maybe integrated within a PCB stackup. Additional plating resist materialsmay be similarly deposited within layers of a PCB stackup. For example,a second plating resist material 3018 may be similarly deposited on asecond core structure or sub-composite structure 3016 which is laminated(e.g., either before or after) or otherwise coupled to the seconddielectric material 3014. A third dielectric material 3020 may bedeposited onto a surface of the second core structure or sub-compositestructure 3016 and the second plating resist material 3018 to furtherbuild the PCB stackup 3026.

A through hole 3026 may then be formed through multiple layers of thePCB stackup 3028 and then plated to form a first plated via segment 3026and a second plated via segment 3024 electrically isolated from eachother. That is, in this example, when the hole 3026 is plated,conductive material is not plated between the first and second platingresist material 3004 and 3006, thereby creating a wide gap/void betweenthe first and second via segments 3022 and 3024.

The examples of wide gaps/voids within a plated through hole illustratedin FIGS. 15, 16, 17, 18, and 20 may be formed in a way similar to theprocess illustrated in FIG. 30. Additionally, embedding of platingresist material with a core structure or sub-composite structure itself(e.g., illustrated in FIGS. 22, 24, 26, and 29) may also be achieved ina similar way during the lamination process of said structures.

In the foregoing specification, embodiments of the invention have beendescribed with reference to numerous specific details that may vary fromimplementation to implementation. The specification and drawings are,accordingly, to be regarded in an illustrative rather than a restrictivesense. The invention is intended to be as broad as the appended claims,including all equivalents thereto.

Those skilled in the art would further appreciate that the variousillustrative logical blocks, modules, circuits, and algorithm stepsdescribed in connection with the embodiments disclosed herein may beimplemented as electronic hardware, computer software, or combinationsof both. To clearly illustrate this interchangeability of hardware andsoftware, various illustrative components, blocks, modules, circuits,and steps have been described above generally in terms of theirfunctionality. Whether such functionality is implemented as hardware orsoftware depends upon the particular application and design constraintsimposed on the overall system.

While certain exemplary embodiments have been described and shown in theaccompanying drawings, it is to be understood that such embodiments aremerely illustrative of and not restrictive on the broad invention, andthat this invention not be limited to the specific constructions andarrangements shown and described, since various other modifications mayoccur to those ordinarily skilled in the art.

The invention claimed is:
 1. A multilayer printed circuit board, comprising: a first core or sub-composite structure; a first plating resist selectively positioned on a first surface of the first core or sub-composite structure; a second plating resist selectively positioned on a second surface of the first core or sub-composite structure or within a dielectric layer of the first core or sub-composite structure, the second surface opposite the first surface; one or more dielectric layers on each side of the first core or sub-composite structure; and a through hole extending through the first core or sub-composite structure, the first plating resist, the second plating resist, and the one or more dielectric layers, where an interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist to form a first internal via segment electrically isolated from a second internal via segment along the plated through hole.
 2. The multilayer printed circuit board of claim 1, wherein neither end of the first internal via segment or the second internal via segment extends to a surface of the multilayer printed circuit board.
 3. The multilayer printed circuit board of claim 1, further comprising: a third plating resist selectively positioned within a first dielectric layer distinct from the first core or sub-composite structure; a fourth plating resist selectively positioned within a second dielectric layer distinct from the first core or sub-composite structure; wherein the through hole extends through the first dielectric layer, the second dielectric layer, the third plating resist, and the fourth plating resist, where the interior surface of the through hole is plated with the conductive material except along a first void between the first plating resist and the third plating resist and a second void between the second plating resist and the fourth plating resist.
 4. The multilayer printed circuit board of claim 3, wherein a third via segment is formed between the third plating resist and a first exterior surface of the multilayer printed circuit board, and a fourth via segment is formed between the fourth plating resist and a second exterior surface of the multilayer printed circuit board, the third via segment, fourth via segment, and internal via segment electrically isolated from each other.
 5. A method for making a printed circuit board having a partitioned plated through hole, comprising: forming a first core or sub-composite structure; selectively depositing a first plating resist on a first dielectric layer within the first core or sub-composite structure or external to the first core or sub-composite structure; selectively depositing a second plating resist in a second dielectric layer within the first core or sub-composite structure or external to the first core or sub-composite structure; forming a through hole through the first core or sub-composite structure, the first plating resist, and the second plating resist; and plating an interior surface of the through hole with a conductive material except along a segment of the through hole between the first plating resist and the second plating resist, such that a first via segment is formed and is electrically isolated from a second via segment.
 6. The method of claim 5, wherein the first dielectric layer and second dielectric layer are both external to the first core or sub-composite structure.
 7. The method of claim 5, wherein the first dielectric layer and second dielectric layer are both internal to the first core or sub-composite structure.
 8. The method of claim 5, wherein the first dielectric layer is internal to the first core or sub-composite structure and the second dielectric layer is external to the first core or sub-composite structure.
 9. The method of claim 5, wherein the first dielectric layer is internal to the first core or sub-composite structure and the second dielectric layer is internal to a second core or sub-composite structure.
 10. The method of claim 5, wherein the first dielectric layer and second dielectric layer are both external to the first core or sub-composite structure, and further comprising: selectively depositing a third plating resist in a third dielectric layer; selectively depositing a fourth plating resist in a fourth dielectric layer, wherein the through hole extends through the third dielectric layer, the fourth dielectric layer, the third plating resist, and the fourth plating resist, where the interior surface of the through hole is plated with the conductive material except along a second length between the third plating resist and the fourth plating resist to form a third via segment electrically isolated from the first via segment and second via segment.
 11. The method of claim 5, wherein a first thickness of the first plating resist is less than a second thickness of the first dielectric layer.
 12. The method of claim 5, wherein a first thickness of the first plating resist is approximately the same as a second thickness of the first dielectric layer.
 13. The method of claim 5, wherein at least one of the first plating resist and second plating resist has a radius greater than a radius of the through hole.
 14. A multilayer printed circuit board, comprising: a first core or sub-composite structure; a first plating resist selectively positioned on a first dielectric layer within the first core or sub-composite structure or external to the first core or sub-composite structure; a second plating resist selectively positioned on a second dielectric layer within the first core or sub-composite structure or external to the first core or sub-composite structure; and a through hole extending through the first core or sub-composite structure, the first plating resist, the second plating resist, where an interior surface of the through hole is plated with conductive material except along a length of the through hole between the first plating resist and the second plating resist to form a first internal via segment electrically isolated from a second internal via segment along the through hole.
 15. The multilayer printed circuit board of claim 14, wherein the first dielectric layer and second dielectric layer are both external to the first core or sub-composite structure.
 16. The multilayer printed circuit board of claim 14, wherein the first dielectric layer and second dielectric layer are both internal to the first core or sub-composite structure.
 17. The multilayer printed circuit board of claim 14, wherein the first dielectric layer is internal to the first core or sub-composite structure and the second dielectric layer is external to the first core or sub-composite structure.
 18. The multilayer printed circuit board of claim 14, wherein the first dielectric layer is internal to the first core or sub-composite structure and the second dielectric layer is internal to a second core or sub-composite structure.
 19. The multilayer printed circuit board of claim 14, wherein a first thickness of the first plating resist is less than a second thickness of the first dielectric layer.
 20. The multilayer printed circuit board of claim 14, wherein a first thickness of the first plating resist is approximately the same as a second thickness of the first dielectric layer. 